8.Design and Environmental Specifications

8.1Intel® Server Boards S5000PSL and S5000XSL Design Specifications

The operation of the server boards at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability.

Table 41. Server Board Design Specifications

Note:

1 Chassis design must provide proper airflow to avoid exceeding the Intel® Xeon® processor 5000 sequence maximum case temperature.

Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel-developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

8.2Board-level Calculated MTBF

The predicted board Mean Time Between Failures is 97,549 hours of operation. As of this writing, actual MTBF testing across multiple systems is completed with a demonstrated 25,222 hours. Since the validation test is only run up to about 25,000 hours across multiple servers, Intel still maintains that actual MTBF data will likely be over 97,549 hours of operation based on statistical regression.